Jasper is the code name for the next motherboard for the Xbox 360. It will becoming next August, in time for next year’s holiday season. Jasper is going to have a 65-nanometer graphics chip from ATI Technologies, as well as smaller memory chips.ATI uses TSMC to make its chips out of Taiwan, and TSMC hasn’t been the fastest at moving to 65-nm manufacturing.
Both Falcon and its predecessor Zephyr (used in the Xbox 360 Elite) have different thermal solutions than the original Xbox 360. You’ve seen the heat sinks in the cut-out photos posted elsewhere. The Microsoft engineers believe those heat sinks will be sufficient as a solution for keeping Xbox 360s from overheating. From their point of view, you don’t have to wait until Jasper to get a reliable machine.
Jasper would be more reliable than Falcon on heat issues, and Falcon will be more reliable than its predecessors. The Falcon board has the same old 90-nm graphics chip on it. And many have pointed out that the big heat problem in the Xbox 360 is due to the graphics chip. The Falcon board will likely give off less heat. But the real serious heat saver looks like it will come with Jasper.
Source: www.blogs.mercurynews.com
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