MICROSOFT has lined up all the chips it needs to build its upcoming Xbox revision named Jasper.
Jasper is due this summer and features chippery shrunk from 90nm to 65.
IBM is supplying 65nm Xenon microprocessors for the box. Now, according to CENS, TSMC is to build 65nm graphics chips and north-bridge chips for its latest version of XBox360 game consoles Advanced Semiconductor Engineering Inc. (ASE) will do the packaging and Nanya PCB Corp. has a hand in the deal too.
The Chinese wire says Microsoft has booked foundry capacity for some 10,000 300mm wafers at TSMC.
It also says a further Xbox, with integrated GP and CPU and named Valhalla, is set for autumn 2009
Source: www.theinquirer.net
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